ICSMA 2019 - 2019 2nd International Conference on Smart Materials Applications

[基本信息]

会议名称:ICSMA 2019 - 2019 2nd International Conference on Smart Materials Applications

开始日期:2019-01-19

结束日期:2019-01-21

所在国家:Japan

所在城市:Tokyo

具体地点:Japan Tokyo

主办单位:South Asia Institute of Science and Engineering(SAISE)

议题:Topics of interest include (but not limited to) the following: Materials Science and Engineering Materials Properties, Measuring Methods and Applications Methodology of Research and Analysis and Modeling Materials Manufacturing and Processing

[重要日期]

参会报名截止日期:2018-10-15

摘要截稿日期:2018-09-05

[会务组联系方式]

联系人:Ms. Chelsea Wang

联系电话:+852-30717761 (Hong Kong) / +86-18062000004 (China)

E-MAIL: icsmaatsaise.org

[会议背景介绍]

ICSMA provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of smart materials Analysis. The meeting will provide an opportunity to highlight recent developments and to identify emerging and future areas of growth in this exciting field.

[征文范围及要求]

2019 2nd International Conference on Smart Materials Applications (ICSMA 2019)--SCOPUS, Ei Compendex 2019 2nd International Conference on Smart Materials Applications (ICSMA 2019) will take place in Tokyo, Japan during January 19-21, 2019. ICSMA 2019 is organized by South Asia Institute of Science and Engineering(SAISE). More details, please visit: http://www.icsma.org Conference Proceedings: All submissions will be peer reviewed, the registered and presented papers will be published into IOP Conference Series: Materials Science and Engineering (Online ISSN: 1757-899X; Print ISSN: 1757-8981), which is indexed by SCOPUS, Ei Compendex (CPX). Contact Ms. Chelsea Wang Conference Secretary of ICSMA (1) Via Email: icsmasaise.org (2) Tel: +852-30717761 (Hong Kong) / +86-18062000004 (China) (Office Time 9:30 - 18:00, Time zone: GMT+8; Monday to Friday)